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Patent Searching and Data


Title:
ADHESIVE ASSEMBLY METHOD FOR STRING-TIGHTENING TYPE SEMI-RIGID SUBSTRATE FRAME
Document Type and Number:
WIPO Patent Application WO/2022/089582
Kind Code:
A1
Abstract:
An adhesive assembly method for a string-tightening type semi-rigid substrate frame, comprising: performing adhesive assembly to form a central frame (104); mounting reinforcing beams and limiting beams for trial assembly; performing adhesive assembly to form an external frame (112); and bonding corner boxes and corner pieces (114) to obtain the string-tightening type semi-rigid substrate frame. By means of the method, the problems in existing adhesive assembly methods for a string-tightening type semi-rigid substrate frame of tight adhesive assembly period, poor assembly precision, large assembly stress, etc. are solved.

Inventors:
XU TING (CN)
ZHENG JIANHU (CN)
CHEN WEIQIANG (CN)
SHEN SHUKANG (CN)
XU WEILI (CN)
ZHANG YUSHENG (CN)
LI YU (CN)
CUI LINRU (CN)
Application Number:
PCT/CN2021/127429
Publication Date:
May 05, 2022
Filing Date:
October 29, 2021
Export Citation:
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Assignee:
BEIJING WEIXING MFG PLANT CO LTD (CN)
International Classes:
F16B11/00
Foreign References:
CN112343907A2021-02-09
CN111098507A2020-05-05
CN102748563A2012-10-24
CN109263057A2019-01-25
CN109774190A2019-05-21
US20160253444A12016-09-01
US20140113116A12014-04-24
FR2749088A11997-11-28
Attorney, Agent or Firm:
CREDOIP INTELLECTUAL PROPERTY AGENCY (CN)
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