ADHESIVE ATTACHMENT ASSEMBLY WITH HEAT SOURCE

Title:

ADHESIVE ATTACHMENT ASSEMBLY WITH HEAT SOURCE

Document Type and Number:

WIPO Patent Application WO2004053010

Kind Code:

A3

Abstract:

An adhesive attachment assembly is provided for mounting an attachment member such as a threaded stud or the like onto a substrate, wherein the attachment assembly includes a heat source (18) for rapidly curing a selected adhesive bonding agent (16). The adhesive attachment assembly includes a first attachment component defining a base surface (24) for receiving the curable bonding agent thereon (16), and a second attachment component (28) adapted for temporary connection to the substrate. Upon pressed mounting of the first attachment component with bonding agent (16) thereon onto the substrate, the second attachment component (28) is movable into temporary engagement with the substrate, and a spring member reacts between the first and second (28) attachment components to apply a positive force urging the first attachment component toward the substrate for the duration of the bonding agent cure time.

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Inventors:

HUTTER CHARLES G III

Application Number:

PCT/US2003/036694

Publication Date:

September 15, 2005

Filing Date:

November 13, 2003

Export Citation:

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Assignee:

PHYSICAL SYSTEMS (US)

International Classes:

B29C65/34; B29C65/78; F16B11/00; F16B37/04; (IPC1-7): H05B1/00; H05B11/00; H05B3/06; H05B3/30; B32B7/12; B32B31/20; B32B31/26

Foreign References:

US3719792A	1973-03-06
US4778702A	1988-10-18
US4822656A	1989-04-18
US4338151A	1982-07-06
US4302492A	1981-11-24

Other References: