Title:
ADHESIVE BASE MATERIAL WITH WIRING LINE, MULTILAYER DEVICE, GLASS LAMINATE, AND METHOD FOR PRODUCING ADHESIVE BASE MATERIAL WITH WIRING LINE
Document Type and Number:
WIPO Patent Application WO/2024/034246
Kind Code:
A1
Abstract:
The present invention provides an adhesive base material with a wiring line, the adhesive base material being capable of suppressing the occurrence of a crack or buckling in a wiring pattern that is formed on an adhesive layer. An adhesive base material (1) with a wiring line according to one embodiment of the present disclosure is provided with: a base material (10); an adhesive layer (11) that is formed on the base material (10); and a wiring pattern (12) that is formed on the adhesive layer (11). The adhesive layer (11) has an adhesive force of 0.01 N/25 mm or more with respect to a PET film; if the adhesive layer is immersed in isopropyl alcohol for one minute, the amount of layer thickness change is 20% or less; and if the adhesive layer is immersed in toluene for one minute, the amount of layer thickness change is 18% or less.
Inventors:
FUJITA KENJI (JP)
Application Number:
PCT/JP2023/021103
Publication Date:
February 15, 2024
Filing Date:
June 07, 2023
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
H05K1/03; B32B7/025; C03C27/12; C09J7/00; C09J9/00; H01B5/14; H01B13/00; H05K3/38
Domestic Patent References:
| WO2022124094A1 | 2022-06-16 |
Foreign References:
| JP2022011082A | 2022-01-17 | |||
| JP2017117568A | 2017-06-29 | |||
| JP2018160395A | 2018-10-11 | |||
| JP2014141660A | 2014-08-07 | |||
| JP2019038904A | 2019-03-14 | |||
| JP2014045078A | 2014-03-13 |
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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