Title:
ADHESIVE BODY
Document Type and Number:
WIPO Patent Application WO/2024/101424
Kind Code:
A1
Abstract:
The present invention provides an adhesive body in which a reduction in adhesive force after storage and transport is suppressed, even in configurations that do not have a detachment liner. The present invention relates to an adhesive body comprising an adhesive agent, wherein the adhesive agent composition that forms the adhesive agent contains a base polymer and a tackifying resin having a weight average molecular weight of 1500 or less.
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Inventors:
MORISHITA HIROMITSU (JP)
SHIMOKAWA KAYO (JP)
TSUKAMOTO NARUMI (JP)
SHIMOKAWA KAYO (JP)
TSUKAMOTO NARUMI (JP)
Application Number:
PCT/JP2023/040415
Publication Date:
May 16, 2024
Filing Date:
November 09, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J201/10; C09J7/38; C09J11/06
Domestic Patent References:
| WO2020071508A1 | 2020-04-09 |
Foreign References:
| JP2014080598A | 2014-05-08 | |||
| JP2021195401A | 2021-12-27 | |||
| US20170335145A1 | 2017-11-23 | |||
| JPH03231980A | 1991-10-15 |
Attorney, Agent or Firm:
EIKOH, P.C. (JP)
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