Title:
ADHESIVE, ADHESIVE FOR BONDING DISSIMILAR MATERIALS, ADHESIVE SHEET, AND ADHESIVE SHEET FOR BONDING DISSIMILAR MATERIALS
Document Type and Number:
WIPO Patent Application WO/2022/124336
Kind Code:
A1
Abstract:
The present invention provides an epoxy adhesive which is capable of undergoing cohesive failure without the occurrence of interfacial debonding even in cases where dissimilar materials are bonded by the epoxy adhesive, while maintaining good bonding strength. An epoxy adhesive which contains an epoxy resin (A) and a curing agent (B), and which is characterized in that: a bisphenol A epoxy resin (A1), a bisphenol F epoxy resin (A2) and a rubber-modified epoxy resin (A3) are contained as the epoxy resin (A); and the content ratio of the bisphenol A epoxy resin (A1) to the bisphenol F epoxy resin (A2), namely (A1)/(A2) is less than 2.7.
Inventors:
TAKAGI SEIJI (JP)
IKEDA MASASHI (JP)
IKEDA MASASHI (JP)
Application Number:
PCT/JP2021/045142
Publication Date:
June 16, 2022
Filing Date:
December 08, 2021
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C09J11/06; C09J7/24; C09J7/25; C09J11/08; C09J163/00; C09J163/02
Foreign References:
| JPH09316303A | 1997-12-09 | |||
| JP2015517001A | 2015-06-18 | |||
| JP2020055993A | 2020-04-09 | |||
| JP2010270198A | 2010-12-02 | |||
| JP2011148867A | 2011-08-04 |
Other References:
"Review: Epoxy Resins", vol. 1, November 2003
"Review: Epoxy Resins Recent Progress I", March 2009
"Review: Epoxy Resins Recent Progress I", March 2009
Attorney, Agent or Firm:
SAITOH Yukihiko et al. (JP)
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