Title:
ADHESIVE COMPOSITION AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/233962
Kind Code:
A1
Abstract:
Provided are an adhesive composition having excellent adhesiveness to resinous materials and an article including a cured object formed from the adhesive composition. This adhesive composition includes either a polyether polycarbonate diol having a number-average molecular weight of 500-10,000 and not having a specific reactive silicon group or a polyether polycarbonate polymer (A) having the specific reactive silicon group.
Inventors:
FUJISAKI SHOGO (JP)
SHIMOMA HITOSHI (JP)
LIU XUHUI (JP)
ITO TAKASHI (JP)
SUNAYAMA YOSHITAKA (JP)
NAKAMURA MAKITO (JP)
SHIMOMA HITOSHI (JP)
LIU XUHUI (JP)
ITO TAKASHI (JP)
SUNAYAMA YOSHITAKA (JP)
NAKAMURA MAKITO (JP)
Application Number:
PCT/JP2023/017825
Publication Date:
December 07, 2023
Filing Date:
May 12, 2023
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
C09J169/00; B32B27/00; B32B27/26; B32B27/40; C08G64/00; C08G65/28; C08G65/336; C09J171/02
Foreign References:
| JP2018528997A | 2018-10-04 | |||
| JP2013527281A | 2013-06-27 | |||
| CN114133908A | 2022-03-04 | |||
| JP2013533328A | 2013-08-22 | |||
| JP2021059722A | 2021-04-15 | |||
| US20170313816A1 | 2017-11-02 | |||
| JP2019502781A | 2019-01-31 | |||
| JPH05239202A | 1993-09-17 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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