Title:
ADHESIVE COMPOSITION FOR BONDING WATER AND SUPPORTING BODY FOR SAID WAFER, ADHESIVE FILM, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2013/065417
Kind Code:
A1
Abstract:
This adhesive composition for bonding a wafer and a supporting body for the wafer contains an elastomer which contains, as a constituent unit for the main chain, a styrene unit in an amount of from 14% by weight to 50% by weight (inclusive), said styrene unit having a weight average molecular weight of from 10,000 to 200,000 (inclusive).
Inventors:
IMAI HIROFUMI
OGATA TOSHIYUKI
KUBO ATSUSHI
YOSHIOKA TAKAHIRO
OGATA TOSHIYUKI
KUBO ATSUSHI
YOSHIOKA TAKAHIRO
Application Number:
PCT/JP2012/074014
Publication Date:
May 10, 2013
Filing Date:
September 20, 2012
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
C09J153/02; C09J7/02; C09J109/06; H01L21/304
Foreign References:
| JP2011122069A | 2011-06-23 | |||
| JP2010050321A | 2010-03-04 | |||
| JP2005183689A | 2005-07-07 | |||
| JP2009529065A | 2009-08-13 | |||
| JP2010506406A | 2010-02-25 | |||
| JP2007258663A | 2007-10-04 | |||
| JP2010120901A | 2010-06-03 | |||
| JP2009263316A | 2009-11-12 | |||
| JP2009263596A | 2009-11-12 |
Other References:
SIVERSTEIN; BASSLER; MORRILL: "Spectrometric identification of organic compounds - combined use of MS, IR, NMR, UV", 1992
See also references of EP 2757136A4
See also references of EP 2757136A4
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
Download PDF:
Claims:
Previous Patent: AQUEOUS DISPERSION AND METHOD FOR PRODUCING SAME
Next Patent: LIGHT SOURCE UNIT ADJUSTMENT DEVICE CALIBRATION METHOD AND STANDARD
Next Patent: LIGHT SOURCE UNIT ADJUSTMENT DEVICE CALIBRATION METHOD AND STANDARD