ADHESIVE COMPOSITION FOR CONNECTING SEMICONDUCTOR CIRCUITS, AND ADHESIVE FILM INCLUDING SAME

Title:

ADHESIVE COMPOSITION FOR CONNECTING SEMICONDUCTOR CIRCUITS, AND ADHESIVE FILM INCLUDING SAME

Document Type and Number:

WIPO Patent Application WO/2020/251219

Kind Code:

A1

Abstract:

The present invention relates to: an adhesive composition for connecting semiconductor circuits; and an adhesive film including same. An adhesive composition for connecting semiconductor circuits according to the present invention can, even while exhibiting excellent adhesion during the thermocompression bonding of semiconductor circuits, minimize warpage of a wafer caused by stacking the semiconductor circuits.

More Like This:

JP3533985	ROOM TEMPERATURE CURING ORGANOPOLYSILOXANE COMPOSITION
JP5397822	Micelle and its use
JP5270786	Adhesive composition for optical film, adhesive layer for optical film, adhesive optical film and image display device

Inventors:

KIM JUNGHAK (KR)
KYUNG YOU JIN (KR)
LEE KWANG JOO (KR)
JEONG MINSU (KR)
KIM JU HYEON (KR)
KIM YOUNGSAM (KR)

Application Number:

PCT/KR2020/007338

Publication Date:

December 17, 2020

Filing Date:

June 05, 2020

Export Citation:

Click for automatic bibliography generation Help

Assignee:

LG CHEMICAL LTD (KR)

International Classes:

C09J183/12; C09J7/00; C09J11/00

Foreign References:

KR100962936B1	2010-06-09
KR20130125224A	2013-11-18
KR20100134293A	2010-12-23
JP2017193610A	2017-10-26

Other References:

LEE, SUNG SOO ET AL.: "Functional Silsesqirioxane Coating Materials", POLYMER SCIENCE AND TECHNOLOGY, vol. 27, no. 4, August 2016 (2016-08-01), pages 287 - 296

Attorney, Agent or Firm:

YOU ME PATENT AND LAW FIRM (KR)

Download PDF:

View/Download PDF PDF Help

Previous Patent: BIOMIMETIC REVERSE ELECTRODIALYSIS APPARATUS

Next Patent: METHOD FOR FERMENTING GREEN COFFEE BEANS, AND FERMENTATION CONTAINER THEREFOR