ADHESIVE COMPOSITION, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER

Title:

ADHESIVE COMPOSITION, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER

Document Type and Number:

WIPO Patent Application WO/2008/015852

Kind Code:

A1

Abstract:

An adhesion composition comprising (a) a thermoplastic resin, (b) a radically polymerizable compound having one or more fluorene structure in the molecule, and (c) a radical polymerization initiator.

Inventors:

IZAWA HIROYUKI (JP)
SHIRASAKA TOSHIAKI (JP)
KUDOU SUNAO (JP)
TOMIZAWA KEIKO (JP)
KATOGI SHIGEKI (JP)

Application Number:

PCT/JP2007/062585

Publication Date:

February 07, 2008

Filing Date:

June 22, 2007

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD (JP)
IZAWA HIROYUKI (JP)
SHIRASAKA TOSHIAKI (JP)
KUDOU SUNAO (JP)
TOMIZAWA KEIKO (JP)
KATOGI SHIGEKI (JP)

International Classes:

C09J4/00; C09J129/14; C09J133/00; C09J167/00; C09J171/10; C09J175/04; C09J179/08; H01B1/22; H01L21/60; H05K1/03; H05K3/32

Foreign References:

JP2005187661A	2005-07-14
JP2004339499A	2004-12-02
JP2005123025A	2005-05-12
JP2005054140A	2005-03-03
JP2003089775A	2003-03-28
JP2002337274A	2002-11-27
JPH1067970A	1998-03-10
JPH01113480A	1989-05-02
JP2002203427A	2002-07-19
JP3522634B2	2004-04-26
JP2002285128A	2002-10-03

Other References:

See also references of EP 2048209A4
J.P. FOUASSIER: "Photoinitiation, Photopolymerization, and Photocuring", 1995, HANSER PUBLISHERS, pages: 17

Attorney, Agent or Firm:

HASEGAWA, Yoshiki et al. (Ginza First Bldg.10-6, Ginza 1-chom, Chuo-ku Tokyo, JP)

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