Title:
ADHESIVE COMPOSITION, CURED MATERIAL AND COMPOSITE
Document Type and Number:
WIPO Patent Application WO/2020/189579
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an adhesive composition causing only low warpage and having excellent adhesion when the adhesive composition adheres dissimilar materials to each other. The adhesive composition according to the present invention is characterized by comprising a component (A) that is a monofunctional epoxy resin, a component (B) that is a polyfunctional radically polymerizable compound, a component (C) that is a curing agent, and a component (D) that is a thermal radical initiator, the composition (C) being at least one selected from the group consisting of a component (c-1) that is an epoxy adduct-type latent curing agent, a component (c-2) that is a hydrazide compound, a component (c-3) that is a cyclic amidine salt, and a component (c-4) that is a thermal cationic polymerization initiator.
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Inventors:
OTSUKI NAOYA (JP)
Application Number:
PCT/JP2020/011240
Publication Date:
September 24, 2020
Filing Date:
March 13, 2020
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
International Classes:
C09J4/00; C09J11/06; C09J163/00
Domestic Patent References:
| WO2008035791A1 | 2008-03-27 |
Foreign References:
| JP2017052922A | 2017-03-16 | |||
| JPH05501783A | 1993-04-02 | |||
| JP2010280896A | 2010-12-16 | |||
| JP2012211244A | 2012-11-01 | |||
| JP2010013507A | 2010-01-21 | |||
| JP2015196326A | 2015-11-09 | |||
| US20150275382A1 | 2015-10-01 | |||
| JP2014091789A | 2014-05-19 | |||
| US20150284607A1 | 2015-10-08 | |||
| JP2009108278A | 2009-05-21 | |||
| JP2019050094A | 2019-03-28 |
Other References:
See also references of EP 3943563A4
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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