Title:
ADHESIVE COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENTS, AND ADHESIVE FOR PORTABLE ELECTRONIC DEVICES
Document Type and Number:
WIPO Patent Application WO/2022/149537
Kind Code:
A1
Abstract:
An adhesive composition according to the present invention contains: a moisture-curable resin (A) which has at least one of a polycarbonate skeleton and a polyester skeleton, while having an isocyanate group and a (meth)acryloyl group; and a moisture-curable resin (B) which has isocyanate group, but does not have a (meth)acryloyl group.
Inventors:
TAMAGAWA TOMOKAZU (JP)
HAGIWARA KOUHEI (JP)
JO KON (JP)
KIDA TAKUMI (JP)
YUUKI AKIRA (JP)
HAGIWARA KOUHEI (JP)
JO KON (JP)
KIDA TAKUMI (JP)
YUUKI AKIRA (JP)
Application Number:
PCT/JP2021/048726
Publication Date:
July 14, 2022
Filing Date:
December 28, 2021
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J4/02; C08G18/44; C09J175/06; C09J175/14
Domestic Patent References:
| WO2020129994A1 | 2020-06-25 | |||
| WO2020149377A1 | 2020-07-23 |
Foreign References:
| JP2016027119A | 2016-02-18 | |||
| JP2003313531A | 2003-11-06 | |||
| JP5824597B1 | 2015-11-25 | |||
| JP2012114243A | 2012-06-14 | |||
| JP2012067278A | 2012-04-05 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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