Title:
ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/120542
Kind Code:
A1
Abstract:
This adhesive composition contains: a pyridinium salt represented by general formula (1); a cationic polymerizable compound; and a polymerization initiator, wherein the polymerization initiator contains an onium salt. An adhesive film for circuit connection contains said adhesive composition and conductive particles. This connection structure comprises: a first circuit member having a first electrode; a second circuit member having a second electrode; and a connection section that is positioned between the first circuit member and the second circuit member, and electrically connects the first electrode and the second electrode to each other, wherein the connection section includes a cured product of the adhesive film for circuit connection.
Inventors:
MORIYA TOSHIMITSU (JP)
KOBAYASHI RYOHTA (JP)
YAMAZAKI YUTA (JP)
KOBAYASHI RYOHTA (JP)
YAMAZAKI YUTA (JP)
Application Number:
PCT/JP2022/046973
Publication Date:
June 29, 2023
Filing Date:
December 20, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08G59/68; C09J7/35; C09J9/02; C09J11/06; C09J163/00; H01B1/22; H05K1/14; H05K3/32
Foreign References:
| JP2020154246A | 2020-09-24 | |||
| JPS63273602A | 1988-11-10 | |||
| JP2015078252A | 2015-04-23 | |||
| JP2017214472A | 2017-12-07 | |||
| JP2017040904A | 2017-02-23 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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