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Title:
ADHESIVE COMPOSITION AND ADHESIVE FILM HAVING SAME, SUBSTRATE PROVIDED WITH ADHESIVE COMPOSITION, AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2015/107990
Kind Code:
A1
Abstract:
The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A), a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt% to 30 wt%, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt% to 10 wt%, and T/M being 400 to 8000, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.

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Inventors:
ODA TAKURO (JP)
KANAMORI DAISUKE (JP)
NONAKA TOSHIHISA (JP)
Application Number:
PCT/JP2015/050483
Publication Date:
July 23, 2015
Filing Date:
January 09, 2015
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C09J179/08; C09J7/20; C09J11/04; C09J11/06; C09J163/00; H01L21/60
Domestic Patent References:
WO2006132165A12006-12-14
Foreign References:
JP2004319823A2004-11-11
JP2006342287A2006-12-21
JP2002129126A2002-05-09
JP2013035881A2013-02-21
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