Title:
ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, SEMICONDUCTOR PACKAGE USING FILM-LIKE ADHESIVE, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/210427
Kind Code:
A1
Abstract:
Provided are: a composition for an adhesive, the composition containing an epoxy resin (A) having a fused ring in its skeleton, an epoxy resin curing agent (B), a polyrotaxane compound (C), and a polymer component (D), the polyrotaxane compound (C) being contained in an amount of 5-15 parts by mass relative to 100 parts by mass of the total contained amount of the epoxy resin (A) and the polymer component (D); a film-like adhesive in which the composition for an adhesive is used; and a semiconductor package and a method for manufacturing the same.
Inventors:
TOKUHISA KENJI (JP)
Application Number:
PCT/JP2023/015341
Publication Date:
November 02, 2023
Filing Date:
April 17, 2023
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C09J163/00; C09J7/30; C09J11/04; C09J11/08; H01L21/301; H01L21/52
Domestic Patent References:
| WO2015129513A1 | 2015-09-03 | |||
| WO2005080469A1 | 2005-09-01 | |||
| WO2005108464A1 | 2005-11-17 | |||
| WO2018203527A1 | 2018-11-08 | |||
| WO2017158994A1 | 2017-09-21 |
Foreign References:
| JP2010180333A | 2010-08-19 | |||
| KR20170065245A | 2017-06-13 | |||
| JP2019085493A | 2019-06-06 | |||
| US20200131396A1 | 2020-04-30 | |||
| JP2006316089A | 2006-11-24 | |||
| JP2021024963A | 2021-02-22 | |||
| JP2016058138A | 2016-04-21 | |||
| JP2015203037A | 2015-11-16 | |||
| JP2022075368A | 2022-05-18 |
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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