Title:
ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/157805
Kind Code:
A1
Abstract:
The present invention discloses an adhesive composition which contains a thermosetting resin, a curing agent and an elastomer, and which is configured such that: the thermosetting resin contains an epoxy resin that has an alicyclic ring; and the elastomer contains an elastomer that has a carboxy group. The present invention also discloses a film-like adhesive which uses this adhesive composition. The present invention additionally discloses: an adhesive sheet which uses this film-like adhesive; and a method for producing a semiconductor device.
Inventors:
HASHIMOTO SHINTARO (JP)
YAHATA TATSUYA (JP)
MASUNO DAISUKE (JP)
TANIGUCHI KOUHEI (JP)
NAKAMURA YUKI (JP)
YAHATA TATSUYA (JP)
MASUNO DAISUKE (JP)
TANIGUCHI KOUHEI (JP)
NAKAMURA YUKI (JP)
Application Number:
PCT/JP2019/002789
Publication Date:
August 06, 2020
Filing Date:
January 28, 2019
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J163/00; C09J7/35; C09J11/04; C09J133/02; H01L21/301; H01L21/50
Domestic Patent References:
| WO2017195902A1 | 2017-11-16 | |||
| WO2015151960A1 | 2015-10-08 |
Foreign References:
| JP2011088966A | 2011-05-06 | |||
| JP2009007424A | 2009-01-15 | |||
| JP2004059859A | 2004-02-26 | |||
| JP2003338580A | 2003-11-28 | |||
| JP2005126658A | 2005-05-19 | |||
| JPH09181128A | 1997-07-11 | |||
| JP2010118636A | 2010-05-27 | |||
| JP2001294843A | 2001-10-23 | |||
| JP2016100532A | 2016-05-30 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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