Title:
ADHESIVE COMPOSITION, FILM ADHESIVE, ADHESIVE SHEET, CIRCUIT CONNECTOR AND CIRCUIT MEMBER CONNECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2013/042203
Kind Code:
A1
Abstract:
An adhesive composition for adhering a first circuit member, in which a first circuit electrode is formed on the main surface of a first circuit board, to a second circuit member, in which a second circuit electrode is formed on the main surface of a second circuit board, at least one of the circuit members comprising a thermoplastic resin with a glass transition temperature of 200°C or less, so that the first circuit electrode and the second circuit electrode are electrically connected. The adhesive composition contains core-shell silicone microparticles having a core layer and a shell layer provided so as to cover the core layer.
Inventors:
IZAWA HIROYUKI (JP)
ARIFUKU MOTOHIRO (JP)
KATOGI SHIGEKI (JP)
YOKOTA HIROSHI (JP)
YAMAMURA TAIZOU (JP)
ARIFUKU MOTOHIRO (JP)
KATOGI SHIGEKI (JP)
YOKOTA HIROSHI (JP)
YAMAMURA TAIZOU (JP)
Application Number:
PCT/JP2011/071388
Publication Date:
March 28, 2013
Filing Date:
September 20, 2011
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
IZAWA HIROYUKI (JP)
ARIFUKU MOTOHIRO (JP)
KATOGI SHIGEKI (JP)
YOKOTA HIROSHI (JP)
YAMAMURA TAIZOU (JP)
IZAWA HIROYUKI (JP)
ARIFUKU MOTOHIRO (JP)
KATOGI SHIGEKI (JP)
YOKOTA HIROSHI (JP)
YAMAMURA TAIZOU (JP)
International Classes:
C09J201/00; C09J4/00; C09J7/20; C09J9/02; C09J11/04; C09J11/08; H01B1/20; H01L21/60; H05K1/14
Domestic Patent References:
| WO2008023565A1 | 2008-02-28 | |||
| WO2009051043A1 | 2009-04-23 |
Foreign References:
| JP2009170898A | 2009-07-30 | |||
| JP2003064331A | 2003-03-05 | |||
| JP2010265338A | 2010-11-25 | |||
| JP2010180334A | 2010-08-19 | |||
| JP2008308618A | 2008-12-25 | |||
| JP2000169722A | 2000-06-20 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
Download PDF:
Claims: