ADHESIVE COMPOSITION FOR FLOOR COVERINGS

Title:

ADHESIVE COMPOSITION FOR FLOOR COVERINGS

Document Type and Number:

WIPO Patent Application WO/2003/025082

Kind Code:

A1

Abstract:

An adhesive composition for floor coverings which comprises (a) an aqueous dispersion of an acrylic resin prepared from a monomer component containing an alkyl acrylate and&sol or an alkyl methacrylate as the main component, (b) a tackifier, (c) a compound represented by the general formula: R¹−O−(CHR²−CH₂−O)n−H, and (d) a filler. This adhesive composition little harms the environment by virtue of its being based on water, and is excellent in freeze−thaw stability and initial laying properties of floor coverings and applicable to various floor coverings including PVC floor sheet and PVC floor tiles.

Inventors:

SUNOUCHI HIDEKI (JP)
ANDO AKIHIRO (JP)
NISHIWAKI KOUICHI (JP)
YAMAMOTO TADAHIRO (JP)

Application Number:

PCT/JP2002/009145

Publication Date:

March 27, 2003

Filing Date:

September 09, 2002

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TAJIMA INC (JP)
EMULSION TECHNOLOGY CO LTD (JP)
SUNOUCHI HIDEKI (JP)
ANDO AKIHIRO (JP)
NISHIWAKI KOUICHI (JP)
YAMAMOTO TADAHIRO (JP)

International Classes:

C09J133/06; C09J133/04; C09J171/02; E04F15/10; (IPC1-7): C09J133/04; C09J11/06; E04F15/10

Foreign References:

JP2000313865A	2000-11-14
JP2000281996A	2000-10-10
JP2000281999A	2000-10-10
JPH09324162A	1997-12-16
JPH08120252A	1996-05-14
JPH02255782A	1990-10-16

Attorney, Agent or Firm:

Shirai, Shigetaka (2-5 Nishi-shinbashi 2-chom, Minato-ku Tokyo, JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: DIE ATTACHED ADHESIVES FOR SEMICONDUCTOR DEVICES, AN EFFICIENT PROCESS FOR PRODUCING SUCH DEVICES AN...

Next Patent: ADHESIVE SILICONE RUBBER HAVING RELEASING PROPERTY