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Patent Searching and Data


Title:
ADHESIVE COMPOSITION, ADHESIVE LAMINATE, PROCESS FOR PRODUCING ADHESIVE LAMINATE, AND MULTILAYERED LAMINATE
Document Type and Number:
WIPO Patent Application WO/1999/047622
Kind Code:
A1
Abstract:
An adhesive composition which is obtained by dry-blending 100 parts by weight of an ethylene polymer powder with 0.1 to 10 parts by weight of an organic peroxide; an adhesive laminate comprising a layer of the composition and a layer of a thermoplastic elastomer composition; a process for producing the adhesive laminate; and a multilayered laminate comprising the adhesive laminate and a polyurethane layer formed thereon. The adhesive composition can bond the layer of a thermoplastic elastomer composition to the polyurethane layer with a sufficient bonding strength, and necessitates neither a complicated step nor a solvent-containing adhesive (primer) which is problematic from the standpoint of working atmosphere.

Inventors:
OHTANI KOHSUKE (JP)
NAKATSUJI YOSHIHIRO (JP)
IKETANI KOHICHI (JP)
Application Number:
PCT/JP1999/001276
Publication Date:
September 23, 1999
Filing Date:
March 16, 1999
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
OHTANI KOHSUKE (JP)
NAKATSUJI YOSHIHIRO (JP)
IKETANI KOHICHI (JP)
International Classes:
B32B7/12; B29C65/48; B32B27/00; B32B27/08; B32B27/40; B32B37/00; C09J123/04; (IPC1-7): C09J123/04; B32B27/26; B32B27/32; C09J7/02
Foreign References:
JP5922978A
JPH0529658A1993-02-05
JP4429988B1
JPS60243184A1985-12-03
JPH09208755A1997-08-12
JP5838770A
JP5838771A
Attorney, Agent or Firm:
Jinno, Naoyoshi (Limited Intellectual Property Dept. 5-33 Kitahama 4-chome Chuo-ku, Osaka-shi Osaka, JP)
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