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Title:
ADHESIVE COMPOSITION FOR MEDICAL DEVICES AND MEDICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/093127
Kind Code:
A1
Abstract:
An adhesive composition for medical devices, comprising: at least one type of epoxy resin (A) selected from a group comprising a bisphenol A epoxy resin, a bisphenol F epoxy resin, and a phenol novolak epoxy resin; and a modified silicone (B).

Inventors:
YOKOYAMA HIROKI (JP)
KOBAYASHI KOJI (JP)
MATSUMOTO JUN (JP)
NIINO RIEKO (JP)
Application Number:
PCT/JP2014/076275
Publication Date:
June 25, 2015
Filing Date:
October 01, 2014
Export Citation:
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Assignee:
OLYMPUS CORP (JP)
International Classes:
C09J163/04; C09J163/02; C09J183/04; G02B23/24
Foreign References:
JP2003126023A2003-05-07
JP2002238834A2002-08-27
JP2005152461A2005-06-16
JP2010143987A2010-07-01
JP2003292924A2003-10-15
JP2007330706A2007-12-27
JP2009242508A2009-10-22
JPS6268829A1987-03-28
JP2007270010A2007-10-18
JP2000265147A2000-09-26
JP2009094493A2009-04-30
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
Sumio Tanai (JP)
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