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Title:
ADHESIVE COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/053589
Kind Code:
A1
Abstract:
The present invention relates to an adhesive composition that seals connection parts in a semiconductor device in which the connection part of a semiconductor chip and the connection part of a wiring circuit board are electrically connected together, or in a semiconductor device in which the connection parts of a plurality of semiconductor chips are electrically connected together, wherein the adhesive composition contains an epoxy resin, a curing agent, and a vinyl-based surface treatment filler.

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Inventors:
HONDA KAZUTAKA (JP)
NAGAI AKIRA (JP)
ENOMOTO TETSUYA (JP)
Application Number:
PCT/JP2011/074153
Publication Date:
April 26, 2012
Filing Date:
October 20, 2011
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
HONDA KAZUTAKA (JP)
NAGAI AKIRA (JP)
ENOMOTO TETSUYA (JP)
International Classes:
C09J163/00; C09J11/04; C09J11/06; C09J179/08; C09J201/00; H01L23/29; H01L23/31
Foreign References:
JPH11345517A1999-12-14
JP2009256612A2009-11-05
JP2009262227A2009-11-12
JP2009239138A2009-10-15
JP2006196850A2006-07-27
JP2002060716A2002-02-26
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
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