Title:
ADHESIVE COMPOSITION, SEALING SHEET AND SEALED BODY
Document Type and Number:
WIPO Patent Application WO/2018/092800
Kind Code:
A1
Abstract:
The present invention provides: an adhesive composition which contains (A) a modified polyolefin resin, (B) a multifunctional epoxy compound, (C) a curing accelerator and (D) a silane coupling agent, and which is characterized in that if a test piece obtained using this adhesive composition is subjected to a 180° peeling test, the value x calculated by formula (1) is 1.3 or less; a sealing sheet which has an adhesive layer that is formed using this adhesive composition; and a sealed body which is obtained by sealing an object to be sealed by means of this sealing sheet.
In the formula, a represents the adhesive power as obtained by performing a 180° peeling test at a temperature of 23°C and at a relative humidity of 50%; and b represents the adhesive power as obtained by performing a 180° peeling test at a temperature of 23°C and at a relative humidity of 50% after leaving the test piece at rest at a temperature of 60°C and at a relative humidity of 90% for 100 hours and subsequently leaving the test piece at rest at a temperature of 23°C and at a relative humidity of 50% for 24 hours.
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Inventors:
HASEGAWA TATSUKI (JP)
NISHIJIMA KENTA (JP)
KASHIO MIKIHIRO (JP)
NISHIJIMA KENTA (JP)
KASHIO MIKIHIRO (JP)
Application Number:
PCT/JP2017/041074
Publication Date:
May 24, 2018
Filing Date:
November 15, 2017
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J123/26; B32B15/00; B32B17/00; B32B27/00; C09J7/00; C09J11/06; C09J163/00; C09K3/10; H01L31/048
Domestic Patent References:
| WO2016042837A1 | 2016-03-24 | |||
| WO2011062167A1 | 2011-05-26 | |||
| WO2004024843A1 | 2004-03-25 | |||
| WO2017094591A1 | 2017-06-08 |
Foreign References:
| JP2002037963A | 2002-02-06 | |||
| JP2016040369A | 2016-03-24 | |||
| JP2000007861A | 2000-01-11 | |||
| JP2015059198A | 2015-03-30 | |||
| JP2008163344A | 2008-07-17 |
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
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