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Title:
ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/035906
Kind Code:
A1
Abstract:
Disclosed is an adhesive composition containing a resin component, a thermal crosslinking agent, and a curing agent, wherein the resin component includes a resin having a maleimide group.

Inventors:
HONDA KAZUTAKA (JP)
UENO KEIKO (JP)
Application Number:
PCT/JP2018/030299
Publication Date:
February 20, 2020
Filing Date:
August 14, 2018
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J179/08; C09J4/02; C09J7/10; C09J7/35; H01L21/60
Domestic Patent References:
WO2013035206A12013-03-14
WO2013035205A12013-03-14
WO2016031553A12016-03-03
Foreign References:
JP2016210851A2016-12-15
JP2007131716A2007-05-31
JP2016196557A2016-11-24
JP2017047686A2017-03-09
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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