ADHESIVE COMPOSITION FOR SEMICONDUCTOR PROCESSING, FILM COMPRISING SAME FOR SEMICONDUCTOR PROCESSING, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE USING SAME

Title:

ADHESIVE COMPOSITION FOR SEMICONDUCTOR PROCESSING, FILM COMPRISING SAME FOR SEMICONDUCTOR PROCESSING, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE USING SAME

Document Type and Number:

WIPO Patent Application WO/2023/146043

Kind Code:

A1

Abstract:

The present invention relates to: an adhesive composition for semiconductor processing that can produce film having highly reliable adhesiveness to wafers; film comprising the adhesive composition for semiconductor processing; and a method for producing semiconductor packages using the film.

Inventors:

SONG HEE (KR)
HAN JI HO (KR)
LEE KWANG JOO (KR)

Application Number:

PCT/KR2022/011220

Publication Date:

August 03, 2023

Filing Date:

July 29, 2022

Export Citation:

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Assignee:

LG CHEMICAL LTD (KR)

International Classes:

C09J11/06; C08K5/3492; C09J4/00; C09J133/04; H01L21/683

Domestic Patent References:

WO2010121068A2

2010-10-21

Foreign References:

CN111909638A	2020-11-10
KR20210014503A	2021-02-09
US20110003914A1	2011-01-06
JP2010084047A	2010-04-15

Attorney, Agent or Firm:

PCR INTELLECTUAL PROPERTY LAW FIRM (KR)

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