Title:
ADHESIVE COMPOSITION, ADHESIVE SHEET, ELECTROMAGNETIC-WAVE SHIELDING FILM, LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/136361
Kind Code:
A1
Abstract:
[Problem] To provide an adhesive composition that has excellent adhesion to both metal substrates and various resin substrates such as those made of polyimide, and that also has exceptional solder heat resistance, low dielectric characteristics, insulation reliability, and flame retardancy. [Solution] The adhesive composition includes: an acid-modified polyolefin (a); a curing agent (b); and a phosphorus-based flame retardant (c), wherein the phosphorus-based flame retardant (c) has an alicyclic skeleton in the molecule.
Inventors:
SONODA RYO (JP)
KAWAKUSU TETSUO (JP)
KAWAKUSU TETSUO (JP)
Application Number:
PCT/JP2023/001208
Publication Date:
July 20, 2023
Filing Date:
January 17, 2023
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/00; C09J7/10; C09J7/22; C09J11/06; C09J123/30; H05K1/03
Foreign References:
| JP2020063353A | 2020-04-23 | |||
| JP2021003886A | 2021-01-14 | |||
| JPH08109333A | 1996-04-30 | |||
| JP2004099519A | 2004-04-02 | |||
| JP2019502809A | 2019-01-31 | |||
| JP2000103969A | 2000-04-11 | |||
| JP2005105203A | 2005-04-21 |
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