Title:
ADHESIVE COMPOSITION AND ADHESIVE SHEET, LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/205917
Kind Code:
A1
Abstract:
[Problem] To provide an adhesive composition that: exhibits superior liquid crystal polymer dispersion properties and a low dielectric constant and dielectric loss tangent; can easily be formed into a polymer sheet that exhibits superior heat resistance; and exhibits superior circuit embedding properties and peel strength when used as an adhesive for a flexible printed wiring board. [Solution] An adhesive composition containing an amorphous polyester resin (A) and a liquid crystal polymer (B), wherein the average particle size (D50) of the liquid crystal polymer (B) is less than 40 µm, and the content of the liquid crystal polymer (B) is 10-150 parts by mass relative to 100 parts by mass of the amorphous polyester resin (A).
Inventors:
SAKAMOTO KOICHI (JP)
MIURA WATARU (JP)
KAWAKUSU TETSUO (JP)
MIURA WATARU (JP)
KAWAKUSU TETSUO (JP)
Application Number:
PCT/JP2021/013044
Publication Date:
October 14, 2021
Filing Date:
March 26, 2021
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/00; B32B27/36; C09J7/30; C09J11/06; C09J11/08; C09J167/00; H05K1/03
Domestic Patent References:
| WO2019172227A1 | 2019-09-12 | |||
| WO2016031342A1 | 2016-03-03 | |||
| WO2014147903A1 | 2014-09-25 |
Foreign References:
| JP2002249754A | 2002-09-06 | |||
| JPH1171567A | 1999-03-16 | |||
| JP2004013054A | 2004-01-15 | |||
| JPH09278966A | 1997-10-28 | |||
| JP2006307093A | 2006-11-09 | |||
| JPH01161045A | 1989-06-23 |
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