Title:
ADHESIVE COMPOSITION, ADHESIVE SHEET, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/016352
Kind Code:
A1
Abstract:
Provided are an adhesive composition capable of joining with sufficient adhesive strength and capable of achieving high package reliability in a semiconductor device in particular, an adhesive sheet having an adhesive layer composed of the adhesive composition, and a method for manufacturing a semiconductor device that uses the adhesive sheet. The adhesive composition according to the present invention is characterized in comprising an acrylic polymer (A) having a weight-average molecular weight (Mw) of 350,000 or higher obtained by polymerizing an acrylic monomer by living radical polymerization using an organotellurium-containing compound as the polymerization initiator, an epoxy thermosetting resin (B), and a thermosetting agent (C).
Inventors:
TSUCHIYAMA SAYAKA (JP)
ICHIKAWA ISAO (JP)
ICHIKAWA ISAO (JP)
Application Number:
PCT/JP2014/070364
Publication Date:
February 05, 2015
Filing Date:
August 01, 2014
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J133/04; C09J7/22; C09J7/30; C09J11/06; C09J163/00; C09J175/04; H01L21/301
Domestic Patent References:
| WO2007119884A1 | 2007-10-25 |
Foreign References:
| JP2009292888A | 2009-12-17 | |||
| JP2007314604A | 2007-12-06 | |||
| JP2009024162A | 2009-02-05 | |||
| JP2011074380A | 2011-04-14 |
Attorney, Agent or Firm:
MAEDA & SUZUKI (JP)
Maeda and a Suzuki international patent business corporation (JP)
Maeda and a Suzuki international patent business corporation (JP)
Download PDF:
Previous Patent: SEAT BACK FRAME, SEAT FOR VEHICLE, AND METHOD FOR MANUFACTURING SEAT BACK FRAME
Next Patent: ANTENNA DEVICE AND COMMUNICATION TERMINAL
Next Patent: ANTENNA DEVICE AND COMMUNICATION TERMINAL