Title:
ADHESIVE COMPOSITION, ADHESIVE SHEET, MULTILAYER BODY AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/014531
Kind Code:
A1
Abstract:
An adhesive composition which contains (a) an acid-modified polyolefin, (b) a phenolic resin that has a polycyclic structure and (c) an epoxy resin, and which additionally contains at least one of (d) an inorganic filler and (e) a flame retardant. The present invention provides an adhesive composition which exhibits high adhesion not only between a metal substrate and a conventional polyimide or polyester film, but also between a metal substrate and a resin substrate such as a liquid crystal polymer or syndiotactic polystyrene, while achieving high solder heat resistance, excellent low dielectric characteristics, tack resistance and flame retardancy.
Inventors:
SONODA RYO (JP)
KAWAKUSU TETSUO (JP)
KAWAKUSU TETSUO (JP)
Application Number:
PCT/JP2021/026144
Publication Date:
January 20, 2022
Filing Date:
July 12, 2021
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C09J123/26; B32B7/12; B32B27/00; B32B27/18; B32B27/20; B32B27/32; C09J7/35; C09J11/04; C09J163/00; C09J169/00; H05K1/03
Domestic Patent References:
| WO2018116967A1 | 2018-06-28 | |||
| WO2021106848A1 | 2021-06-03 |
Foreign References:
| JP2020041100A | 2020-03-19 | |||
| JP2020512209A | 2020-04-23 | |||
| US20160137890A1 | 2016-05-19 |
Download PDF: