Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE COMPOSITION AND ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2008/044561
Kind Code:
A1
Abstract:
Disclosed is an adhesive composition which enables to form an adhesive layer having sufficient heat resistance so that the adhesive power hardly decreases even when an object to which the layer is adhered to is heated. The adhesive composition contains a (meth)acrylate polymer (A) having a weight average molecular weight of 100,000-2,000,000 and a glass transition temperature of from -40˚C to +65˚C, while containing a repeating unit derived from acrylonitrile, a monomer (B) having three or more polymerizable carbon-carbon double bonds, an oligomer (C) having four or more polymerizable carbon-carbon double bonds and a photopolymerization initiator (D). This adhesive composition contains 30-95% by mass of the polymer (A), 1-50% by mass of the monomer (B) and 1-50% by mass of the oligomer (C) (when (A) + (B) + (C) = 100% by mass).

Inventors:
KURITA OSAMU (JP)
KUZUYA MASASHI (JP)
Application Number:
PCT/JP2007/069338
Publication Date:
April 17, 2008
Filing Date:
October 03, 2007
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
EMULSION TECHNOLOGY CO LTD (JP)
KURITA OSAMU (JP)
KUZUYA MASASHI (JP)
International Classes:
C09J133/20; B32B27/00; C09J4/06; C09J7/02
Foreign References:
JP2005023188A2005-01-27
JPS60196956A1985-10-05
JPH10335271A1998-12-18
JPS62153376A1987-07-08
JP2002294184A2002-10-09
Attorney, Agent or Firm:
WATANABE, Kazuhira (No.8 Kikuboshi Tower Building20-18, Asakusabashi 3-chome,Taito-k, Tokyo 53, JP)
Download PDF: