Title:
ADHESIVE COMPOSITION AND ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2017/159788
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an adhesive sheet which is formed from a dual curing adhesive composition, and which has a sufficiently low relative dielectric constant and excellent durability. The present invention relates to an adhesive composition which contains: a base polymer (A) containing units (a1) derived from non-crosslinkable (meth)acrylate esters having a branched alkyl group of 5-9 carbon atoms and units (a2) derived from (meth)acrylate monomers having a cross-linkable functional group; a monomer (B) which contains at least one polymerizable unsaturated group; a cross-linking agent (C) which reacts with the base polymer (A) with heat; and a polymerization initiator (D) which initiates a polymerization reaction of the monomers (B) with irradiation of active energy rays. The present invention further relates to an adhesive sheet formed from said adhesive composition.
Inventors:
MUTO KUNIAKI (JP)
SHIBATA SHUN (JP)
SHIBATA SHUN (JP)
Application Number:
PCT/JP2017/010684
Publication Date:
September 21, 2017
Filing Date:
March 16, 2017
Export Citation:
Assignee:
OJI HOLDINGS CORP (JP)
International Classes:
C09J133/06; C08F2/50; C09J4/02; C09J7/10; C09J11/06; C09J125/04; C09J133/14
Domestic Patent References:
| WO2015155844A1 | 2015-10-15 | |||
| WO2014003173A1 | 2014-01-03 | |||
| WO2017022770A1 | 2017-02-09 | |||
| WO2016170875A1 | 2016-10-27 |
Foreign References:
| JP2013234322A | 2013-11-21 | |||
| JP2014227453A | 2014-12-08 | |||
| JP2014156552A | 2014-08-28 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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