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Title:
ADHESIVE COMPOSITION, ADHESIVE, AND ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2021/149434
Kind Code:
A1
Abstract:
Provided is an adhesive composition containing: a (meth)acrylate ester polymer (A) that includes butyl methacrylate and a monomer containing a reactive functional group as monomeric units that constitute the polymer; and an inorganic filler (C). Also provided are an adhesive obtained by cross-linking said adhesive composition, and an adhesive sheet 1 provided with at least an adhesive layer 12, wherein the adhesive layer 12 is formed from said adhesive composition. Said adhesive composition enables the uniform dispersion of the inorganic filler (C) in a short period of time, even without containing a dispersant. Additionally, the adhesive and the adhesive layer 12 of the adhesive sheet 1 have the inorganic filler (C) uniformly dispersed therein.

Inventors:
KUBO SHUHEI (JP)
MORI TAKESHI (JP)
ANSAI TAKESHI (JP)
Application Number:
PCT/JP2020/047782
Publication Date:
July 29, 2021
Filing Date:
December 21, 2020
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
C09J11/04; C08F220/10; C09J7/38; C09J133/02; C09J133/10
Domestic Patent References:
WO2016121794A12016-08-04
Foreign References:
JP2018024717A2018-02-15
JP2005068291A2005-03-17
JP2019085442A2019-06-06
JP2013227546A2013-11-07
JPH06237054A1994-08-23
JPH04265267A1992-09-21
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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