Title:
ADHESIVE COMPOSITION AND ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/234063
Kind Code:
A1
Abstract:
Provided is an adhesive composition capable of forming an adhesive having high heat resistance while maintaining strong adhesive force with a configuration having a composition containing a styrenic block copolymer capable of achieving strong adhesive force and having greater weather resistance than a non-hydrogenated composition. Provided is an adhesive composition including an acid-modified hydrogenated styrenic block copolymer (A), a crosslinking agent (B) capable of reacting with an acid, a polyphenylene ether resin (C), and a tackifying resin (D). In some preferable embodiments, a ratio (WB/WC) of a content WB [wt%] of the crosslinking agent (B) capable of reacting with the acid to a content WC [wt%] of the polyphenylene ether resin (C) is 3/97 to 7/93.
Inventors:
TAKAHASHI HIROAKI (JP)
NEGISHI NOBUKAZU (JP)
NEGISHI NOBUKAZU (JP)
Application Number:
PCT/JP2023/018648
Publication Date:
December 07, 2023
Filing Date:
May 18, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J153/02; C09J7/38; C09J11/06; C09J11/08; C09J171/12
Foreign References:
| JP2009144144A | 2009-07-02 | |||
| JP2007262392A | 2007-10-11 | |||
| JP2008143975A | 2008-06-26 | |||
| JP2008266387A | 2008-11-06 | |||
| JP2011057884A | 2011-03-24 | |||
| JP2001316562A | 2001-11-16 |
Attorney, Agent or Firm:
OI, Michiko (JP)
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