Title:
ADHESIVE COMPOSITION AND STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/090693
Kind Code:
A1
Abstract:
This adhesive composition contains (a) a thermoplastic resin, (b) a silane compound having a urethane bond and an alkoxysilyl group in one molecule, (c) a radical-polymerizable compound, and (d) a radical-polymerization initiator, and, as a component other than components (a), (c), and (d) or components (a), (b), (c), and (d), contains (e) a compound having a urethane bond. The average coefficient of linear thermal expansion at 30-90°C of the cured product of the adhesive composition does not exceed 800 ppm/K.
Inventors:
MORIJIRI TOMOKI (JP)
TAKETATSU JUN (JP)
TANAKA MASARU (JP)
TATSUZAWA TAKASHI (JP)
SEKI KOTARO (JP)
KIKUCHI KENTA (JP)
TAKETATSU JUN (JP)
TANAKA MASARU (JP)
TATSUZAWA TAKASHI (JP)
SEKI KOTARO (JP)
KIKUCHI KENTA (JP)
Application Number:
PCT/JP2016/084853
Publication Date:
June 01, 2017
Filing Date:
November 24, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J201/00; C09J4/00; C09J9/02; C09J11/04; C09J11/06; C09J175/14; H01L21/60; H05K1/14; H05K3/32
Foreign References:
| JP2009256581A | 2009-11-05 | |||
| JP2010111846A | 2010-05-20 | |||
| JP2009256619A | 2009-11-05 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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