Title:
ADHESIVE COMPOSITION FOR TEMPORARY FIXING
Document Type and Number:
WIPO Patent Application WO/2013/021945
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an acrylic adhesive composition for temporary fixing, which is suitable for suppressing chipping of a silicon wafer when the silicon wafer is processed from a silicon block. This adhesive composition for temporary fixing contains (1) a monomer that has a (meth)acryloyl group, (2) a polymerization initiator, (3) a β-diketone chelate and/or a β-ketoester, and (4) an inorganic filler.
Inventors:
NAKAJIMA GOSUKE (JP)
KANAI TOMOYUKI (JP)
YODA KIMIHIKO (JP)
OSHIMA KAZUHIRO (JP)
KANAI TOMOYUKI (JP)
YODA KIMIHIKO (JP)
OSHIMA KAZUHIRO (JP)
Application Number:
PCT/JP2012/069851
Publication Date:
February 14, 2013
Filing Date:
August 03, 2012
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
NAKAJIMA GOSUKE (JP)
KANAI TOMOYUKI (JP)
YODA KIMIHIKO (JP)
OSHIMA KAZUHIRO (JP)
NAKAJIMA GOSUKE (JP)
KANAI TOMOYUKI (JP)
YODA KIMIHIKO (JP)
OSHIMA KAZUHIRO (JP)
International Classes:
C09J4/02; B28D5/04; B28D7/04; C09J11/04; C09J11/06; H01L21/304
Foreign References:
| JP2011089055A | 2011-05-06 | |||
| JP2010265453A | 2010-11-25 | |||
| JP2011122100A | 2011-06-23 | |||
| JP2010084072A | 2010-04-15 | |||
| JP2011142253A | 2011-07-21 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
Download PDF:
Claims:
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