Title:
ADHESIVE COMPOSITION AND THERMALLY ADHESIVE COMPOSITE MEMBER USING SAME
Document Type and Number:
WIPO Patent Application WO/2015/046378
Kind Code:
A1
Abstract:
Provided is an adhesive composition which, in a composite of a polyolefin resin molded article and another member, provides exceptional heat resistance and solvent resistance in the adhered portions. This adhesive composition is a composition containing an organic solvent, a modified polyolefin resin that dissolves in the organic solvent, and a polyfunctional isocyanate compound. The modified polyolefin resin is a resin obtained through graft modification of an unmodified polyolefin resin, by a modifying agent containing an α，β-unsaturated carboxylic acid or derivative thereof, the resin having relative permittivity in the range of 2.02-2.50 at a frequency of 1 GHz.
Inventors:
ITO TAKAHIRO (JP)
SUGIKI TOMOYA (JP)
SUGIKI TOMOYA (JP)
Application Number:
PCT/JP2014/075522
Publication Date:
April 02, 2015
Filing Date:
September 25, 2014
Export Citation:
Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C09J123/26; B32B15/085; B32B15/095; C09J11/06; C09J151/06; C09J175/04
Domestic Patent References:
| WO2013114934A1 | 2013-08-08 | |||
| WO2012090646A1 | 2012-07-05 | |||
| WO2009087776A1 | 2009-07-16 | |||
| WO2002026846A1 | 2002-04-04 | |||
| WO2014123183A1 | 2014-08-14 |
Foreign References:
| JP2002110111A | 2002-04-12 |
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