Title:
ADHESIVE COMPOSITION AND THERMALLY ADHESIVE MEMBER USING SAME
Document Type and Number:
WIPO Patent Application WO/2012/090646
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an adhesive composition that imparts sufficient adhesive strength when used for bonding to a polyolefin resin molded article that bonds poorly with other members. Another purpose of the present invention is to provide an adhesive composition having excellent heat resistance (heat-resistant adhesive properties) and the like in the bonded part of a joined body obtained by joining a polyolefin resin molded article and another member. This adhesive composition contains an organic solvent, a carboxyl group-containing polyolefin resin which is dissolved in this organic solvent and which has a melt flow rate of 5 to 40 g/10 min when measured at 130°C, and a polyfunctional isocyanate compound. This adhesive composition may further contain a carboxyl group-containing polyolefin resin having a melting point of 120 to 170°C.
Inventors:
ITO TAKAHIRO (JP)
IMAHORI MAKOTO (JP)
NISHIO TATSUO (JP)
IMAHORI MAKOTO (JP)
NISHIO TATSUO (JP)
Application Number:
PCT/JP2011/077929
Publication Date:
July 05, 2012
Filing Date:
December 02, 2011
Export Citation:
Assignee:
TOAGOSEI CO LTD (JP)
ITO TAKAHIRO (JP)
IMAHORI MAKOTO (JP)
NISHIO TATSUO (JP)
ITO TAKAHIRO (JP)
IMAHORI MAKOTO (JP)
NISHIO TATSUO (JP)
International Classes:
C09J123/26; B32B15/085; C09J175/04
Domestic Patent References:
| WO2005082963A1 | 2005-09-09 | |||
| WO2008013085A1 | 2008-01-31 |
Foreign References:
| JP2009235290A | 2009-10-15 | |||
| JPH11293216A | 1999-10-26 | |||
| JP2008030227A | 2008-02-14 | |||
| JP2005002137A | 2005-01-06 | |||
| JPH10273637A | 1998-10-13 | |||
| JPH0418480A | 1992-01-22 |
Other References:
See also references of EP 2660296A4
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Claims: