Title:
ADHESIVE COMPOSITION, THERMOSETTING ADHESIVE SHEET, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/151014
Kind Code:
A1
Abstract:
Provided is an adhesive composition which has low dielectric constant and dielectric tangent, and has an excellent flex resistance. This adhesive composition contains, with respect to a total of 100 parts by mass of the adhesive composition: 75-90 parts by mass of a styrene-based elastomer; 3-25 parts by mass of a modified polyphenylene ether resin which has a polymerizable group at an end thereof; and at most 10 parts by mass of an epoxy resin and an epoxy resin curing agent in total.
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Inventors:
YAMAMOTO JUN (JP)
MINEGISHI TOSHIYUKI (JP)
DATE KAZUHIRO (JP)
MINEGISHI TOSHIYUKI (JP)
DATE KAZUHIRO (JP)
Application Number:
PCT/JP2019/001652
Publication Date:
August 08, 2019
Filing Date:
January 21, 2019
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C09J153/02; B32B7/12; B32B15/08; B32B25/14; C08G59/40; C08G65/48; C09J7/22
Domestic Patent References:
| WO2014046014A1 | 2014-03-27 | |||
| WO2012049873A1 | 2012-04-19 | |||
| WO2017033784A1 | 2017-03-02 |
Foreign References:
| JP2011228642A | 2011-11-10 | |||
| JP2010261003A | 2010-11-18 | |||
| JP2015131866A | 2015-07-23 | |||
| JP2011068713A | 2011-04-07 | |||
| JP2016027131A | 2016-02-18 | |||
| JP2018018177A | 2018-02-01 | |||
| JP2017057346A | 2017-03-23 | |||
| JP2016079354A | 2016-05-16 |
Other References:
See also references of EP 3750966A4
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
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