Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2005/033239
Kind Code:
A1
Abstract:
The present invention aims to provide an adhesive composition enabling to obtain a cured product having good adhesion properties. The present invention secondarily aims to reduce the amount of adhesive resin to be used by providing it with such good adhesion properties. The adhesive composition essentially contains (A) a polyoxyalkylene polymer having at least one alkenyl group in one molecule, (B) a compound having 1-3 hydrosilyl groups in one molecule on average, and (C) a hydrosilylation catalyst.
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Inventors:
UEDA KAZUHIKO (JP)
KOMITSU SHINTARO (JP)
KOMITSU SHINTARO (JP)
Application Number:
PCT/JP2004/014145
Publication Date:
April 14, 2005
Filing Date:
September 21, 2004
Export Citation:
Assignee:
KANEKA CORP (JP)
UEDA KAZUHIKO (JP)
KOMITSU SHINTARO (JP)
UEDA KAZUHIKO (JP)
KOMITSU SHINTARO (JP)
International Classes:
C09J7/38; C09J171/02; C09J183/05; (IPC1-7): C09J171/02
Foreign References:
| JP2000302981A | 2000-10-31 | |||
| JP2003292926A | 2003-10-15 | |||
| JPH07300555A | 1995-11-14 | |||
| JPH04145188A | 1992-05-19 | |||
| JPS6055056A | 1985-03-29 |
Other References:
See also references of EP 1674545A4
Attorney, Agent or Firm:
KANEKA CORPORATION (Kita-ku Osaka-sh, Osaka 88, JP)
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