Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2006/115065
Kind Code:
A1
Abstract:
An adhesive composition comprising a polymerizable monomer (a) containing a phosphoric acid group and further containing a fluorocarbon group and a solvent (b), the polymerizable monomer (a) represented by the formula: wherein R is a hydrogen atom or methyl; and each of n, p and q is a natural number and satisfies the relationships 2≤n≤10, p+q ≤ n and p+q+n ≤ 13. This adhesive composition realizes excellent adhesion force and bond durability enabling suitable application to fields, such as those of medical treatment, electronic industry, precision machinery industry and jewelry industry, and is one exhibiting a low fluctuation of adhesion force. As the adhesive composition exhibits excellent bond durability and discoloration resistance to dental restoration materials, such as those of ceramic, composite resin hardened material, porcelain and metals, especially new dental restoration materials, such as those of hybrid ceramics and metal oxide high-strength ceramic, the adhesive composition finds suitable application in dental fields.
Inventors:
NAKATSUKA KAZUMITSU (JP)
NISHIGAKI NAOKI (JP)
KAWASHIMA MITSUNOBU (JP)
NISHIGAKI NAOKI (JP)
KAWASHIMA MITSUNOBU (JP)
Application Number:
PCT/JP2006/307807
Publication Date:
November 02, 2006
Filing Date:
April 13, 2006
Export Citation:
Assignee:
KURARAY MEDICAL INC (JP)
NAKATSUKA KAZUMITSU (JP)
NISHIGAKI NAOKI (JP)
KAWASHIMA MITSUNOBU (JP)
NAKATSUKA KAZUMITSU (JP)
NISHIGAKI NAOKI (JP)
KAWASHIMA MITSUNOBU (JP)
International Classes:
C09J4/02; A61K6/00; A61K6/083; C08F30/02
Foreign References:
JPS61176506A | 1986-08-08 | |||
JP2002038105A | 2002-02-06 | |||
JPS4750093B1 | 1972-12-15 | |||
JPS5821687A | 1983-02-08 | |||
JP2003021881A | 2003-01-24 | |||
JP2002214741A | 2002-07-31 | |||
JPS5821607A | 1983-02-08 | |||
JPS6351308A | 1988-03-04 |
Other References:
See also references of EP 1873219A4
Attorney, Agent or Firm:
Matsuo, Tomohiro (1-13-17-201 Nakatsu, Kita-ku, Osaka-sh, Osaka 71, JP)
Download PDF: