Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/153297
Kind Code:
A1
Abstract:
The present application relates to an adhesive composition and an organic electronic device comprising same, and provides an adhesive composition and an organic electronic device comprising same, the adhesive composition enabling the formation of an encapsulation structure that can effectively block moisture or oxygen from being introduced in the organic electronic device from the outside, thereby enabling the securing of the lifespan of the organic electronic device, and in the process of forming the encapsulation structure of the organic electronic device, can be easily applied, thereby preventing problems such as bubbles being introduced inside the encapsulation structure or an application nozzle being clogged, thus enabling the enhancement of processability.

Inventors:
LEE SEUNG MIN (KR)
KIM SO YOUNG (KR)
SHIM JUNG SUP (KR)
YANG SE WOO (KR)
Application Number:
PCT/KR2016/003008
Publication Date:
September 29, 2016
Filing Date:
March 24, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08L101/02; C08L33/04; C08L63/00; C08L75/04
Foreign References:
KR20140147736A2014-12-30
KR20140136092A2014-11-28
KR20150010667A2015-01-28
KR20130081261A2013-07-16
KR20120091349A2012-08-17
Other References:
See also references of EP 3275943A4
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
특허법인 다나 (KR)
Download PDF:



 
Previous Patent: ADHESIVE COMPOSITION

Next Patent: ADHESIVE COMPOSITION