Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/061061
Kind Code:
A1
Abstract:
The present invention pertains to an adhesive composition containing 15-25 parts by weight of a 1-butene homopolymer, 12-22 parts by weight of an α-olefin copolymer having a melting point of 90°C or higher, 30-50 parts by weight of a tackifying resin having a softening point of 125°C or higher, 6-22 parts by weight of a polypropylene-based wax, and 4-20 parts by weight of a liquid hydrocarbon.
Inventors:
TAKAHASHI YUZURU (JP)
Application Number:
PCT/JP2015/083265
Publication Date:
April 13, 2017
Filing Date:
November 26, 2015
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J123/20; C09J11/06; C09J11/08; C09J123/00; C09J123/12; C09J123/14
Foreign References:
JPH11181386A | 1999-07-06 | |||
JP2004284575A | 2004-10-14 | |||
JP2001523285A | 2001-11-20 | |||
JPH02196878A | 1990-08-03 | |||
JP2002535453A | 2002-10-22 | |||
JPH0320381A | 1991-01-29 | |||
JPH08269417A | 1996-10-15 | |||
JPH11323289A | 1999-11-26 | |||
JPH05140522A | 1993-06-08 | |||
JP2005290339A | 2005-10-20 | |||
JP2013216724A | 2013-10-24 | |||
JP2004284575A | 2004-10-14 |
Other References:
See also references of EP 3360942A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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