Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/084308
Kind Code:
A1
Abstract:
Provided is an adhesive composition which is cured by an active energy ray, while having excellent adhesive force. This adhesive composition contains the following components (A) to (C).
(A) 100 parts by weight of a (meth)acrylic polymer which has one or more groups represented by general formula (1) at an end of each molecule
-OC(O)C(R1)=CH2 (1)
(In the formula, R1 represents a hydrogen atom or an organic group having 1-20 carbon atoms.)
(B) 45-65 parts by weight of isoboronyl acrylate
(C) 0.1-10 parts by weight of a radical photopolymerization initiator
Inventors:
TANAKA HIDENORI
Application Number:
PCT/JP2017/040088
Publication Date:
May 11, 2018
Filing Date:
November 07, 2017
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C09J133/00; C09J4/02; C09J4/06; C09J11/06; C09J133/08
Domestic Patent References:
| WO2017154660A1 | 2017-09-14 |
Foreign References:
| JP2012116931A | 2012-06-21 | |||
| JP2007077182A | 2007-03-29 | |||
| JP2014172920A | 2014-09-22 |
Other References:
See also references of EP 3536756A4
Attorney, Agent or Firm:
PATENT CORPORATE BODY ARCO PATENT OFFICE (JP)
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