Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/179609
Kind Code:
A1
Abstract:
The present invention relates to an adhesive composition which comprises an α-olefin homopolymer, an α-olefin copolymer having a melting point of 90°C or higher, a tackifying resin, wax, and a liquid softener, wherein the adhesive composition has a complex shear modulus (I) of 1 MPa or less measured immediately after the adhesive composition has cooled down to 20°C after being heated to 180°C.
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Inventors:
TAKAHASHI YUZURU (JP)
Application Number:
PCT/JP2017/044414
Publication Date:
October 04, 2018
Filing Date:
December 11, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J123/00; C09J11/06; C09J11/08; C09J123/10; C09J123/12; C09J123/20
Domestic Patent References:
| WO2017061061A1 | 2017-04-13 |
Foreign References:
| JP2013064055A | 2013-04-11 | |||
| JP2014210841A | 2014-11-13 | |||
| JP2014189584A | 2014-10-06 | |||
| JPH08269417A | 1996-10-15 | |||
| JPH11181386A | 1999-07-06 | |||
| JP2004284575A | 2004-10-14 | |||
| JP2017095685A | 2017-06-01 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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