Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/163284
Kind Code:
A1
Abstract:
Provided is an adhesive composition for forming low-dielectric adhesive layers which have satisfactory electrical properties (dielectric properties) that render the adhesive layer adaptable to the 5th generation mobile communication system (5G) and which have satisfactory adhesiveness also to low-dielectric base films having poor bondability and further have heat resistance and chemical resistance (solvent resistance), the adhesive composition being capable of being reduced in resin flow. The adhesive composition comprises a hardener and a resin composition including a modified styrene-based elastomer, wherein the modified styrene-based elastomer is contained in an amount of 25 parts by mass or more per 100 parts by mass of the resin composition and the resin composition has a melt flow rate (200°C, 21.60 kg) of 40 g/10 min or less.
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Inventors:
KATAGIRI WATARU (JP)
MOMMA SHIORI (JP)
MOMMA SHIORI (JP)
Application Number:
PCT/JP2021/048602
Publication Date:
August 04, 2022
Filing Date:
December 27, 2021
Export Citation:
Assignee:
SHINETSU POLYMER CO (JP)
International Classes:
C09J125/08; C09J7/25; C09J7/35; C09J153/02; H05K1/03; H05K3/28
Domestic Patent References:
| WO2016017473A1 | 2016-02-04 | |||
| WO2014147903A1 | 2014-09-25 | |||
| WO2020071154A1 | 2020-04-09 | |||
| WO2001068785A1 | 2001-09-20 | |||
| WO2021131268A1 | 2021-07-01 |
Foreign References:
| JP2017047686A | 2017-03-09 | |||
| JPH08259849A | 1996-10-08 | |||
| JP2016027131A | 2016-02-18 | |||
| JP2007186649A | 2007-07-26 | |||
| JP2004182916A | 2004-07-02 | |||
| JP2018184543A | 2018-11-22 | |||
| JP2009207973A | 2009-09-17 |
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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