Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/255136
Kind Code:
A1
Abstract:
Provided is an adhesive composition that is for forming a low-dielectric adhesive layer having heat resistance and being capable of preventing resin flow (resin flow-out properties), that exhibits excellent adhesiveness even with respect to a low-dielectric base material film having poor adhesiveness, and that has excellent electrical properties (dielectric properties) capable of handling 5G. Further, the adhesive composition can form an adhesive layer having superior adhesion-reliability even after being kept at 150°C for 168 hours. The adhesive composition contains a resin composition including styrene-based elastomers. The styrene-based elastomers include a modified styrene-based elastomer. The styrene-based elastomers also include a styrene-based elastomer having a styrene ratio of 33 or more.
Inventors:
MOMMA SHIORI (JP)
KATAGIRI WATARU (JP)
KATAGIRI WATARU (JP)
Application Number:
PCT/JP2022/021044
Publication Date:
December 08, 2022
Filing Date:
May 23, 2022
Export Citation:
Assignee:
SHINETSU POLYMER CO (JP)
International Classes:
H05K1/03; B32B27/00; C09J7/30; C09J125/08; H05K3/28; H05K9/00
Domestic Patent References:
| WO2016017473A1 | 2016-02-04 | |||
| WO2021131268A1 | 2021-07-01 |
Foreign References:
| JP2014080478A | 2014-05-08 |
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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