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Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/255141
Kind Code:
A1
Abstract:
Provided is an adhesive composition that is for forming a low-dielectric adhesive layer having both heat resistance and chemical resistance (solvent resistance), that exhibits excellent adhesiveness even with respect to a low-dielectric base material film having poor adhesiveness, and that has excellent electrical properties (dielectric properties) capable of handling 5G.　The adhesive composition contains styrene-based elastomers, a bismaleimide resin, and a benzoxazine resin. The styrene-based elastomers include a styrene-based elastomer including an amino group.

Inventors:
KATAGIRI WATARU (JP)
MOMMA SHIORI (JP)
Application Number:
PCT/JP2022/021075
Publication Date:
December 08, 2022
Filing Date:
May 23, 2022
Export Citation:
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Assignee:
SHINETSU POLYMER CO (JP)
International Classes:
H05K1/03; B32B27/00; C09J7/25; C09J7/30; C09J125/08; C09J179/04
Domestic Patent References:
WO2020130008A12020-06-25
WO2020090634A12020-05-07
WO2019230945A12019-12-05
Foreign References:
JP2009161725A2009-07-23
JP2019099712A2019-06-24
JP2007051226A2007-03-01
JP2016190966A2016-11-10
JP2019006879A2019-01-17
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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