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Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/068302
Kind Code:
A1
Abstract:
[Problem] The present invention addresses the problem of developing a chloroprene polymer latex adhesive composition that has excellent adhesiveness to soft polyvinyl chloride resins and also has excellent thermal creep resistance with an adherend. [Solution] A method for producing an adhesive composition characterized by mixing a chloroprene polymer latex (A) that includes a chloroprene polymer and has a gel component content of 15-95%, a (meth)acrylic polymer emulsion (B) that includes a (meth)acrylic polymer having a monomer component represented by formula (1), the Tg of the (meth)acrylic polymer being -30°C to 20°C, and a chlorinated polyolefin resin (C) so that the mass ratio (a:b) of the solids fraction (a) of the chloroprene polymer in the chloroprene polymer latex (A) and the solids fraction (b) of the polymer in the (meth)acrylic polymer emulsion (B) is 90:10 to 65:35. (In general formula (1), R1 represents a hydrogen atom or a methyl group, and R2 represents a linear or branched C1-18 alkyl group.)

Inventors:
OGAWA MASAHIRO (JP)
MAKIO RYO (JP)
OGAWA NORIKO (JP)
SHIBUYA AKIRA (JP)
Application Number:
PCT/JP2022/038953
Publication Date:
April 27, 2023
Filing Date:
October 19, 2022
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
C09J111/02; C09J7/35; C09J11/08; C09J123/28; C09J133/04
Domestic Patent References:
WO2018043586A12018-03-08
WO2022025118A12022-02-03
Foreign References:
JPH10235804A1998-09-08
JPS6296576A1987-05-06
CN108659788A2018-10-16
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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