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Title:
ADHESIVE COMPOSTION, AND COVERLAY FILM AND PRINTED CIRCUIT BOARD THAT INCLUDE SAME
Document Type and Number:
WIPO Patent Application WO/2021/182910
Kind Code:
A1
Abstract:
The present invention relates to an adhesive composition, and a coverlay film and a printed circuit board that include same. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and at least two kinds of rubber.

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Inventors:
PARK KWANGSEOK (KR)
RYU EUIDOCK (KR)
JEONG INKI (KR)
PARK SUBYUNG (KR)
CHAE DONGHO (KR)
Application Number:
PCT/KR2021/003091
Publication Date:
September 16, 2021
Filing Date:
March 12, 2021
Export Citation:
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Assignee:
DOOSAN CORP (KR)
International Classes:
C09J163/00; C08L9/02; C08L23/16; C09J7/22; C09J7/40; H05K3/28
Foreign References:
KR20150035738A2015-04-07
JP2002080812A2002-03-22
JP2007045882A2007-02-22
KR20160065828A2016-06-09
KR101385198B12014-04-29
Other References:
See also references of EP 4116388A4
Attorney, Agent or Firm:
WETHEPEOPLE IP & LAW FIRM (KR)
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