Title:
ADHESIVE, DYNAMOELECTRIC MACHINE, ELECTRONIC COMPONENT, AND AIRCRAFT
Document Type and Number:
WIPO Patent Application WO/2022/195655
Kind Code:
A1
Abstract:
An adhesive (101) of a stress relaxation type configured by using an epoxy compound having two or more allyl functional groups as a main ingredient and an amine-based hardener having a bisphenol A type resin skeleton to configure an epoxy-based base adhesive and incorporating a stress relaxation agent which is an ethylene/acrylic copolymer and/or an ethylene/propylene copolymer each having an average particle diameter of 10 μm or smaller, in an amount of 20 wt% or smaller with respect to the base adhesive.
Inventors:
KAMO YOSHIYUKI (JP)
Application Number:
PCT/JP2021/010324
Publication Date:
September 22, 2022
Filing Date:
March 15, 2021
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
C09J163/10; B64D33/00; C09J11/08
Foreign References:
| JP2018095780A | 2018-06-21 | |||
| JP2008088279A | 2008-04-17 | |||
| JP2017506285A | 2017-03-02 | |||
| JP2001164047A | 2001-06-19 |
Attorney, Agent or Firm:
PALMO PATENT FIRM, P.C. (JP)
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