Title:
ADHESIVE FILM FOR CIRCUIT CONNECTION, ADHESIVE COMPOSITION FOR CIRCUIT CONNECTION, AND CIRCUIT CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/025207
Kind Code:
A1
Abstract:
An adhesive film for circuit connection contains electroconductive particles, and includes, in the film thickness direction, a region A containing a cationically polymerizable compound, a thermal cationic polymerization initiator, and an ion scavenger. The cationically polymerizable compound includes an epoxy compound. The thermal cationic polymerization initiator contains an anirinium salt. The ion scavenger includes one or more metal compounds selected from the group consisting of aluminum hydroxide, aluminum oxide, magnesium hydroxide, magnesium oxide, zirconium hydroxide, zirconium oxide, bismuth hydroxide, bismuth oxide, calcium hydroxide, calcium oxide, tin hydroxide, tin oxide, manganese hydroxide, manganese oxide, antimony hydroxide, antimony oxide, silicon hydroxide, silicon oxide, titanium hydroxide, and titanium oxide.
Inventors:
NAKAZAWA TAKASHI (JP)
FUKUI MASATO (JP)
NARITOMI KAZUYA (JP)
MINOSHIMA JURI (JP)
FUKUI MASATO (JP)
NARITOMI KAZUYA (JP)
MINOSHIMA JURI (JP)
Application Number:
PCT/JP2021/028165
Publication Date:
February 03, 2022
Filing Date:
July 29, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J9/02; C09J7/10; C09J7/35; C09J11/04; C09J11/06; C09J163/00; C09J171/00; C09J201/00; H01L21/60
Domestic Patent References:
| WO2013021895A1 | 2013-02-14 | |||
| WO2016043066A1 | 2016-03-24 |
Foreign References:
| JP2007016088A | 2007-01-25 | |||
| US20170162531A1 | 2017-06-08 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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