Title:
ADHESIVE FILM FOR CIRCUIT CONNECTION, METHOD FOR PRODUCING CIRCUIT CONNECTED STRUCTURE, AND ADHESIVE FILM HOUSING SET
Document Type and Number:
WIPO Patent Application WO/2020/184636
Kind Code:
A1
Abstract:
An adhesive film 11 for circuit connection is provided with: a peelable support film 12, a first adhesive layer 13 containing conductive particles P, the first adhesive layer being disposed on the support film; and a second adhesive layer 14 disposed on the first adhesive layer 13. The thickness of the first adhesive layer is 0.1 to 1.0-times the average particle diameter of the conductive particles.
Inventors:
ITO AKIHIRO (JP)
OTO YUMIKO (JP)
KUDO SUNAO (JP)
OTO YUMIKO (JP)
KUDO SUNAO (JP)
Application Number:
PCT/JP2020/010657
Publication Date:
September 17, 2020
Filing Date:
March 11, 2020
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08F2/48; C09J4/00; C09J7/10; C09J9/02; C09J11/04; C09J201/00; H01R11/01; H05K1/14
Domestic Patent References:
| WO2019050005A1 | 2019-03-14 |
Foreign References:
| JP2011192651A | 2011-09-29 | |||
| JP2007290269A | 2007-11-08 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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